3D IC and 2.5D IC Packaging Market: Advanced Packaging Capacity...

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2026-08-31 14:04:04 -

3D IC and 2.5D IC Packaging Market: Advanced Packaging Capacity Expands

The 3D IC and 2.5D IC packaging market is projected by Future Market Insights (FMI) to increase from USD 63.55 billion in 2026 to USD 150.44 billion by 2036, advancing at a 9.00% CAGR. The market is expected to add approximately USD 86.89 billion over the 2026–2036 forecast period, with AI accelerators and high-bandwidth memory (HBM) demand creating new requirements...

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